 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| Philips Semiconductors Product specification Class AB stereo headphone driver FEATURES * Wide temperature range * No switch ON/OFF clicks * Excellent power supply ripple rejection * Low power consumption * Short-circuit resistant * High performance - high signal-to-noise ratio - high slew rate - low distortion * Large output voltage swing. QUICK REFERENCE DATA VDD = 5 V; VSS = 0 V; Tamb = 25 C; fi = 1 kHz; RL = 32 ; unless otherwise specified. SYMBOL VDD PARAMETER supply voltage single dual VSS IDD Ptot Po (THD + N)/S negative supply voltage supply current total power dissipation maximum output power no load no load THD < 0.1%; note 1 3.0 1.5 -1.5 - - - - - RL = 5 k S/N cs PSRR Tamb Note 1. VDD = 5 V; VO(p-p) = 3.5 V (at 0 dB). ORDERING INFORMATION PACKAGE TYPE NUMBER NAME TDA1308 TDA1308T DIP8 SO8 DESCRIPTION plastic dual in-line package; 8 leads (300 mil) plastic small outline package; 8 leads; body width 3.9 mm signal-to-noise ratio channel separation RL = 5 k power supply ripple rejection fi = 100 Hz; Vripple(p-p) = 100 mV operating ambient temperature - 100 - - - -40 5.0 2.5 -2.5 3 15 60 0.03 -70 -101 110 70 105 90 - CONDITIONS MIN. TYP. GENERAL DESCRIPTION TDA1308 The TDA1308 is an integrated class AB stereo headphone driver contained in an SO8 or a DIP8 plastic package. The device is fabricated in a 1 mm CMOS process and has been primarily developed for portable digital audio applications. MAX. 7.0 3.5 -3.5 5 25 - 0.06 -65 - - - - - +85 UNIT V V V mA mW mW % dB dB dB dB dB dB C total harmonic distortion plus note 1 noise-to-signal ratio VERSION SOT97-1 SOT96-1 August 1994 2 Philips Semiconductors Product specification Class AB stereo headphone driver BLOCK DIAGRAM TDA1308 Fig.1 Block diagram. PINNING SYMBOL OUTA INA(neg) INA(pos) VSS INB(pos) INB(neg) OUTB VDD PIN 1 2 3 4 5 6 7 8 output A inverting input A non-inverting input A negative supply non-inverting input B inverting input B output B positive supply Fig.2 Pin configuration. DESCRIPTION August 1994 3 Philips Semiconductors Product specification Class AB stereo headphone driver TDA1308 August 1994 4 Fig.3 Equivalent schematic diagram. Philips Semiconductors Product specification Class AB stereo headphone driver LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC134). SYMBOL VDD tSC(O) Tstg Tamb Vesd PARAMETER supply voltage output short-circuit duration storage temperature operating ambient temperature electrostatic discharge note 1 note 2 Notes 1. Human body model: C = 100 pF; R = 1500 ; 3 pulses positive plus 3 pulses negative. 2. Machine model: C = 200 pF: L = 0.5 mH: R = 0 ; 3 pulses positive plus 3 pulses negative. THERMAL CHARACTERISTICS SYMBOL Rth j-a DIP8 SO8 QUALITY SPECIFICATION PARAMETER thermal resistance from junction to ambient in free air 109 210 VALUE Tamb = 25 C; Ptot = 1 W CONDITIONS 0 20 -65 -40 -2000 -200 MIN. - +150 +85 TDA1308 MAX. 8.0 V s UNIT C C V V +2000 +200 UNIT K/W K/W In accordance with "UZW-BO/FQ-0601". The numbers of the quality specification can be found in the "Quality Reference Handbook". The handbook can be ordered using the code 9398 510 63011. August 1994 5 Philips Semiconductors Product specification Class AB stereo headphone driver CHARACTERISTICS VDD = 5 V; VSS = 0 V; Tamb = 25 C; fi = 1 kHz; RL = 32 ; unless otherwise specified. SYMBOL Supplies VDD supply voltage single dual VSS IDD Ptot VI(os) Ibias VCM Gv IO RO VO negative supply voltage supply current total power dissipation no load no load 3.0 1.5 -1.5 - - - - 0 RL = 5 k (THD + N)/S < 0.1% note 1 RL = 16 ; note 1 RL = 5 k; note 1 PSRR cs CL power supply rejection ratio channel separation RL = 5 k load capacitance AC characteristics (THD + N)/S total harmonic distortion plus note 2 noise-to-signal ratio note 2; RL = 5 k S/N fG Po Ci SR B Notes 1. Values are proportional to VDD; (THD + N)/S < 0.1%. 2. VDD = 5.0 V; VO(p-p) = 3.5 V (at 0 dB). signal-to-noise ratio unity gain frequency maximum output power input capacitance slew rate power bandwidth unity gain inverting unity gain inverting open-loop; RL = 5 k (THD + N)/S < 0.1% - - - - 100 - - - - - -70 0.03 -101 0.0009 110 5.5 60 3 5 20 -65 0.06 - - - - - - - - fi = 100 Hz; Vripple(p-p) = 100 mV - - - 0.75 1.5 0.1 - - - - 5.0 2.5 -2.5 3 15 7.0 3.5 -3.5 5 25 - - 3.5 - - - 4.25 3.5 4.9 - - - 200 PARAMETER CONDITIONS MIN. TYP. TDA1308 MAX. UNIT V V V mA mW DC characteristics input offset voltage input bias current common mode voltage open-loop voltage gain maximum output current output resistance output voltage swing 10 10 - 70 60 0.25 - - - 90 70 105 - mV pA V dB mA V V V dB dB dB pF dB % dB % dB MHz mW pF V/s kHz August 1994 6 Philips Semiconductors Product specification Class AB stereo headphone driver TEST AND APPLICATION INFORMATION TDA1308 Fig.4 Measurement circuit for inverting application. Fig.5 Example of application with TDA1545A (stereo continuous calibration DAC). August 1994 7 Philips Semiconductors Product specification Class AB stereo headphone driver TDA1308 Fig.6 Open-loop gain as a function of input frequency. Fig.7 Crosstalk as a function of input frequency. Fig.8 Output power as a function of supply voltage. August 1994 8 Philips Semiconductors Product specification Class AB stereo headphone driver TDA1308 Fig.9 Total harmonic distortion plus noise-to-signal ratio as a function of input frequency. Fig.10 Total harmonic distortion plus noise-to-signal ratio as a function of output voltage level. August 1994 9 Philips Semiconductors Product specification Class AB stereo headphone driver PACKAGE OUTLINES TDA1308 handbook, full pagewidth 9.8 9.2 8.25 7.80 seating plane 3.2 max 4.2 max 3.60 3.05 0.51 min 1.15 max 2.54 (3x) 1.73 max 0.53 max 0.254 M 0.38 max 7.62 10.0 8.3 MSA252 - 1 8 5 6.48 6.20 1 4 Dimensions in mm. Fig.11 Plastic dual in-line package; 8 leads (300 mil); DIP8; SOT97-1. August 1994 10 Philips Semiconductors Product specification Class AB stereo headphone driver TDA1308 handbook, full pagewidth 5.0 4.8 4.0 3.8 A S 0.1 S 6.2 5.8 0.7 0.3 8 5 1.45 1.25 0.7 0.6 0.25 0.19 1.75 1.35 1 pin 1 index 4 0.25 0.10 detail A 1.0 0.5 0 to 8 o MBC180 - 1 1.27 0.49 0.36 0.25 M (8x) Dimensions in mm. Fig.12 Plastic small outline package; 8 leads; body width 3.9 mm. (SO8; SOT96-1). August 1994 11 Philips Semiconductors Product specification Class AB stereo headphone driver SOLDERING Plastic dual in-line packages BY DIP OR WAVE The maximum permissible temperature of the solder is 260 C; this temperature must not be in contact with the joint for more than 5 s. The total contact time of successive solder waves must not exceed 5 s. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified storage maximum. If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. REPAIRING SOLDERED JOINTS Apply the soldering iron below the seating plane (or not more than 2 mm above it). If its temperature is below 300 C, it must not be in contact for more than 10 s; if between 300 and 400 C, for not more than 5 s. Plastic small outline packages BY WAVE During placement and before soldering, the component must be fixed with a droplet of adhesive. After curing the adhesive, the component can be soldered. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder bath is 10 s, if allowed to cool to less than 150 C within 6 s. Typical dwell time is 4 s at 250 C. A modified wave soldering technique is recommended using two solder waves (dual-wave), in which a turbulent wave with high upward pressure is followed by a smooth laminar wave. Using a mildly-activated flux eliminates the need for removal of corrosive residues in most applications. BY SOLDER PASTE REFLOW TDA1308 Reflow soldering requires the solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the substrate by screen printing, stencilling or pressure-syringe dispensing before device placement. Several techniques exist for reflowing; for example, thermal conduction by heated belt, infrared, and vapour-phase reflow. Dwell times vary between 50 and 300 s according to method. Typical reflow temperatures range from 215 to 250 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 min at 45 C. REPAIRING SOLDERED JOINTS (BY HAND-HELD SOLDERING IRON OR PULSE-HEATED SOLDER TOOL) Fix the component by first soldering two, diagonally opposite, end pins. Apply the heating tool to the flat part of the pin only. Contact time must be limited to 10 s at up to 300 C. When using proper tools, all other pins can be soldered in one operation within 2 to 5 s at between 270 and 320 C. (Pulse-heated soldering is not recommended for SO packages.) For pulse-heated solder tool (resistance) soldering of VSO packages, solder is applied to the substrate by dipping or by an extra thick tin/lead plating before package placement. August 1994 12 Philips Semiconductors Product specification Class AB stereo headphone driver DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values TDA1308 This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications. Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. August 1994 13 |
Price & Availability of TDA1308T
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |